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Ceramic capacitance dedicated tin stripping liquid ,Tin layer stripping agent,Efficient tin stripping liquid ,Copper material ceramic capacitance tin stripping treatment agent

Product Name:Ceramic capacitance dedicated tin stripping liquid ,Tin layer stripping agent,Efficient tin stripping liquid ,Copper material ceramic capacitance tin stripping treatment agent

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ceramic capacitance dedicated tin stripping liquid ,tin layer stripping agent,efficient tin stripping liquid ,copper material ceramic capacitance tin stripping treatment agent

Ceramic capacitance dedicated tin stripping liquid ,Tin layer stripping agent,Efficient tin stripping liquid ,Copper material ceramic capacitance tin stripping treatment agent



First, product number : Q/YS.403 (Yi Shun brand)


Second,  product performance:

The product is suitable for the nickel plating treatment of nickel base,copper bottom ceramic capacitor, which is characterized by that the agent has no damage to the surface of the ceramic, and does not damage the nickel layer and the copper layer substrate.


Third,product index:

1.Colorless transparent liquid, basically odorless.

2.Proportion:﹥1.0

3.PH value﹤7.0


Fourth, usage method:

1.Capacitors ceramic cleaning, removing dirt and oil, removal of plastic.

2.Capacitance ceramic immerse in tin stripping solution, roll or flip the  ceramics to make uniform remove tin.

3.Rinse with water after removing tin,then remove film to get bright nickel(or copper surface)

4.Washing and Electrolytic tin plating


Fifth,  Matters needing attention:

1.The temperature of usage:﹤40℃(Optimum temperature is 20℃-35℃.

2.This product is strictly prohibited contact with metals such as iron, zinc and manganese.

3.It cannot be exposed to the sun to prevent high temperature and strong radiation.

Other processingChemical Plating Liquid TrainChemical silver plating liquid (copper substrate)、Stainless steel chemical thicker liquid copper  platingTin surface treatment agent series、Copper oil removal passivation agent、Tin stripping liquid(copper substrate)